Richard CanonNews / Thursday, January 11, 2018 / Categories: Canon Patents New stacked sensor patent from Canon Canon continues to apply for a multitude of patents dealing with stacked sensors. This patent is for new ways of interconnecting the sensor and the processing chips together using lapped pads between the two substrates (one for sensor, the other for processing). We saw something like this when Canon was researching ADC's to put on their sensors, where the R&D departments within Canon spent a considerable amount of time and money applying for applicable patents. Whether or not this is a sign of things to come photography, or whether or not this will more apply for high speed 4 and 8K video applications, is anyone's guess right now. Both stills and video could use stacked sensors to improve ISO and DR response not to mention speed up processing. Japan Patent Application 2018-006561 Previous Article Canon’s Focus on Innovation Once Again Lands Imaging Leader a Top Five Spot Among U.S. Patent Holders for 32nd Consecutive Year Next Article Canon looking at infrared (night mode) and color photography compact camera? Print 5186 Leave a comment Name: Please enter a name. Email: Please enter an email address. Please enter a valid email address. Comment: Please enter comment. I agree This form collects your name, email, IP address and content so that we can keep track of the comments placed on the website. For more info check our Privacy Policy and Terms Of Use where you will get more info on where, how and why we store your data. You must read and accept this rules. Add comment