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Canon Patent Application: Method of Manufacturing Back Side Illuminated Dual Pixel AF Sensor
/ Categories: Canon Patents
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Canon Patent Application: Method of Manufacturing Back Side Illuminated Dual Pixel AF Sensor

This patent application indicates a method of manufacturing of what appears to be a stacked illuminated sensor that appears to be like a Back Side illuminated sensor - at least the resulting sensor is formed to be the same structure as a BSI sensor.

For instance, here's a front side illuminated sensor versus a backside illuminated sensor;

From this, you can see that it's very distinct where the wiring exists between the two sensors.  The BSI (backside illuminated sensor) has the wiring underneath the photodiodes.  While this above diagram is a little simplistic the basic principle is demonstrated.

If we look at this patent, we clearly see the sensor is described is similar to the (1) illustration, a back side illuminated sensor.

This would allow Canon to further increase the dynamic range and sensitivity of their sensors.

As Canon states;

 According to the present invention, the solid-state imaging device is provided having an advantageous structure for the production in accordance with an advantageous manufacturing method and the manufacturing method in the density of the charge accumulation region or pixel.

Japan Patent Application 2020-194965


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How to view Japan Patent applications.

Unfortunately, there's no direct way of linking to the patent application (sad!) however, this is the easiest process to view a japan patent or application.

  1. Go to the Japan Patent Office search page.
  2. If it's a patent application (they are usually in the format of Year-Number ie: 2017-011300) then type the patent application number into the second field down from the top where it says publication of patent application. 
  3. Click on search.
  4. Then click on the patent application number link, and there's the patent application!

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