Richard CanonNews / Thursday, April 26, 2018 / Categories: Canon Patents This post may contain affiliate links(s). An affiliate link means I may earn advertising/referral fees if you make a purchase through my link, without any additional cost to you. It helps to keep this site afloat. Thank you in advance for your support. If you like what we do here, maybe buy me a coffee. Canon continues to work on stacked BSI sensors In another patent application describing stacked BSI sensors, canon looks to solve problems with high melting point metal is moved from being on the sensor substrate to only on the peripheral circuit substrate. They are concerned that the high melting point metal will diffuse into the photo diodes collecting image data. There is clearly a trend that Canon is looking to solve what they feel are issues with stacked BSI sensors, and certainly because they plan on actually implementing them one day. Of course there's no timeframe for this, it could take years, or Canon could be rolling them out this year. There's no doubt about it that especially for mirrorless, stacked and BSI sensors are very important. Firstly because of the performance, and secondly because it improves the ability to collect light at high incident angles. More links US Patent Application 20180114808 Richard CanonNewsRichard CanonNews Richard has been using Canon cameras since the 1990s, with his first being the now legendary EOS-3. Since then, Richard has continued to use Canon cameras and now focuses mostly on infrared photography. Richard is the founder and editor of CanonNews since 2017, and has worked as a writer on CanonRumors and other websites in the past. Other posts by Richard CanonNews Contact author Facebook page Print Please login or register to post comments.