This post may contain affiliate links(s). An affiliate link means I may earn advertising/referral fees if you make a purchase through my link, without any additional cost to you
. It helps to keep this site afloat. Thank you in advance for your support. If you like what we do here, maybe buy me a coffee.
Stacked Sensor Patent Application
When you stack or laminate a processing substrate and a sensor substrate as you can imagine you have heat generated from the processing substrate that can affect your image quality, especially in low light, or long exposure conditions. Usually we use long exposure noise reduction which takes a second image (a dark frame) after your first image and removes the noise by subtraction.
This noise is called by what is called "dark current" and is usually purple-ish blobs in corners of your images, which shows where there was a heat source.
This of course is compounded when you have a processing chip stuck to the back of your sensor. As we noted last week, canon is looking at improving this, first by eliminating as much heat as possible mechanically via heat sinks and other methods, and this week we find another application dealing with the same phenomena.
A stacked sensor may have the following heatmap;
what this patent application does is split up the sensor into various heat zones and provides specific correction for each zone. it's not a replacement for LENR (long exposure noise reduction), however a method of reducing the noise from a more problematic level.
Japan Patent Application 2018-019227
blog comments powered by